Semiconductor consulting for advanced ASIC programs

Senior ASIC Physical Design, STA Signoff, and Timing Closure Consulting.

Advance Micro Consulting Inc. (AMCI) helps semiconductor teams close timing, execute physical ECOs, improve implementation methodology, and bring advanced ASIC programs from netlist to tapeout readiness.

Built on 15+ years of hands-on semiconductor implementation, signoff, and methodology experience across advanced ASIC programs.

PD Execution STA Signoff ECO Closure Flow Automation Tapeout Readiness

Track Record

Track record across silicon programs where execution risk mattered.

AMCI has supported advanced silicon programs across PHY/IP, memory interfaces, VR hardware platforms, fintech silicon, and advanced-node ASIC infrastructure.

Memory PHY IP

High-Performance Memory PHY IP

6 testchips 14nm / 12nm / 7nm HBM / GDDR / LPDDR

Context: Advanced memory PHY IP development across HBM, GDDR, and LPDDR standards.

Role: Physical implementation and timing signoff partner across six critical testchips.

Scope: 14nm, 12nm, and 7nm implementation; GDDR6, LPDDR5/4/4x, and HBM3 PHY validation.

Outcome: Supported silicon-proven memory PHY development across multiple standards, nodes, and testchip programs.

Connectivity PHY

High-Speed Connectivity PHY Program

5 testchips 5G PHY Timing signoff

Context: Advanced 5G and high-speed connectivity silicon program.

Role: Physical implementation and timing signoff support for the first five 5G PHY testchips.

Scope: High-complexity physical implementation, signal integrity execution, stringent timing signoff, and testchip delivery support.

Outcome: Helped establish the technical baseline for early high-speed connectivity silicon programs.

PPA Methodology

Scalable PPA Methodology for VR Silicon

1,000+ engineers Python automation PPA optimization

Context: Large-scale VR silicon organization requiring consistent PPA visibility across distributed engineering teams.

Role: Architected custom methodology and Python automation for PPA optimization and engineering decision support.

Scope: Hardware telemetry ingestion, architectural metric correlation, scenario modeling, reporting, and source-of-truth infrastructure.

Outcome: Converted fragmented engineering data into a scalable PPA decision platform supporting faster design-to-signoff cycles.

Fintech Silicon

Secure Payment Silicon to Advanced ASIC Infrastructure

Multi-generation silicon Secure processor Advanced-node ASIC

Context: Fintech silicon platform evolving from secure payment silicon to global payment infrastructure and advanced-node ASIC development.

Role: Provided long-term physical implementation continuity across multiple generations of silicon execution.

Scope: Secure processor SoC implementation, NFC integration, dual-CPU architecture, CTS/signoff, advanced implementation, and thermal/IR analysis.

Outcome: Supported the silicon foundation behind secure payment-terminal deployment and later advanced ASIC infrastructure.

Detailed case study materials available for qualified partners.

Services

Execution-focused consulting from physical design through signoff.

Design Intent
Physical Implementation Fusion Compiler / Innovus
STA / Timing Closure PrimeTime / Tempus
Tapeout Readiness
Methodology, Automation, Physical Verification, and Signoff Support

Physical Design Execution

Block and top-level implementation support from floorplanning, placement, CTS, routing, congestion debug, and ECO closure through signoff convergence.

P&R | CTS | Routing | Congestion | Timing-driven ECO | Block/top-level implementation

STA Signoff & Timing Closure

MMMC timing analysis, setup/hold closure, SI/noise debug, constraint review, timing ECO strategy, and regression triage.

MMMC | Setup/Hold | PrimeTime | Tempus | SI/Noise | Constraint Debug | PBA/GBA | Timing ECOs

Flow Development & Automation

Custom Tcl, Python, Make, and reporting automation to improve implementation repeatability, QoR visibility, and cross-team execution.

Tcl | Python | Make | Dashboards | QoR Tracking | Regression Checks | Methodology Automation

Chip Finishing & Tapeout Readiness

Physical verification cleanup, DRC/LVS support, signoff checklist execution, final ECO convergence, and GDS handoff readiness.

DRC | LVS | Antenna | IR/EM Awareness | PV Cleanup | GDS Handoff | Tapeout Readiness

Technical Depth

Technical depth across implementation, signoff, verification, and automation.

Nodes 3nm, 5nm, 7nm, 12nm, 14nm, advanced-node readiness

Implementation Floorplanning, placement, CTS, routing, congestion, ECO closure

STA / Signoff MMMC, setup/hold, SI/noise, constraints, timing ECOs, regression triage

Tools Synopsys Fusion Compiler, ICC2, PrimeTime; Cadence Innovus, Tempus; Calibre, PVS, ICV

Automation Python, Tcl, Perl, Make, reporting dashboards, QoR analysis

Design Contexts PHY/IP, memory interfaces, AI/HPC, VR/consumer silicon, fintech/payment silicon, advanced ASIC infrastructure

Foundry Context Experience with advanced-node implementation environments and major foundry design-rule ecosystems.

Engagement Models

Engagement models built for real implementation and tapeout pressure.

Timing Closure SWAT

Short-term senior support for urgent setup/hold closure, timing regressions, ECO loops, and signoff convergence.

Tapeout Support

Block or full-chip implementation support during critical tapeout windows, from late-stage closure through final handoff.

Flow Bring-Up & Automation

Methodology, scripting, reporting, QoR dashboards, and checks that improve repeatability across implementation teams.

Advisory / Design Review

Senior review of implementation strategy, constraints, timing closure approach, and signoff readiness.

FAQ

Frequently asked questions about AMCI.

Request Availability

Bring senior PD/STA execution into your next closure challenge.

Share your project stage, node, tool stack, and the area where your team needs support, from timing closure and ECO execution to methodology automation and tapeout readiness.